Bond connection device e.g. thermally compressed connection device, for providing connection between e.g. electronic part and planar conducting element, has electronic part spaced at distance in clearance at side of conducting element

摘要

The device has electrical leading pads formed between a planar conducting element (10) and an upper surface of an electronic part (1) e.g. inverter, where the upper surface of the electronic part includes a metallization part (3). Clearances are formed between the pads, and the electronic part is spaced at a distance in the clearance at a side of the conducting element, where the side of the conducting element facing toward the electronic part. The conducting element is designed as a pre-conditioning element i.e. pre-conditioning film, with recesses. Independent claims are also included for the following: (1) a method for manufacturing a bond connection device (2) a bond connection tool (3) an electronic circuitry carrier.