发明名称
摘要 <P>PROBLEM TO BE SOLVED: To provide an electrode substrate capable of reducing resistance of the electrode substrate, and suppressing deterioration in characteristics caused by electrical leak from metal wiring to an electrolyte and corrosion of a metal wiring layer. <P>SOLUTION: The electrode substrate 1 is formed by laminating a transparent conductive layer 11, a metal wiring layer 12, and an insulating layer 14 covering the metal wiring layer on a substrate 10 in order, and when the coefficient of thermal expansion of the substrate is defined as &alpha; and the coefficient of the thermal expansion of the insulating layer is defined as &beta;, a value of &beta; divided by &alpha; is made 0.5 to 18. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP5208431(B2) 申请公布日期 2013.06.12
申请号 JP20070024604 申请日期 2007.02.02
申请人 发明人
分类号 H01M14/00;H01L31/04 主分类号 H01M14/00
代理机构 代理人
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