| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic module which has improved heat dissipation properties and also allows size reduction. <P>SOLUTION: A metal substrate 3 has conductor wiring 33 which is formed, via an insulator layer 32 made of resin, on a top face of a base 31 made of metal. A mold case 4 houses the metal substrate 3 and electronic components, and a bus bar and a terminal for electrical connection to the outside are insert-molded therein. The metal substrate 3 is configured such that the metal base constituted by a conductive member does not come into contact with a grounded conductive member around a vehicle and is bonded and fixed to the mold case constituted by an insulation member, while the base of the metal substrate is electrically ungrounded. The metal substrate 3 is bonded and fixed to an end face of the mold case 4, and the base surface of the metal substrate is exposed to the atmosphere outside the mold case. <P>COPYRIGHT: (C)2013,JPO&INPIT |
