| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a moisture-proof insulation mounting circuit board capable of selectively coating a portion or a surface requiring moisture-proof of a mounting circuit board with a liquid moisture-proof insulation material without coating unevenness, liquid scattering and performance of masking, and capable of uniformly forming a thin film without reducing coating adhesion efficiency. <P>SOLUTION: A alcohol-containing or water-based liquid moisture-proof insulation material whose viscosity at 20°C of liquid temperature is 8 to 11 mPa s, and conductivity is 0.5 to 4m S/cm is applied onto a mounting circuit board heated at 20 to 50°C in advance with a continuous type ink jet device. <P>COPYRIGHT: (C)2013,JPO&INPIT |
