MULTILAYER PRINTED CIRCUIT BOARD INCLUDING METAL PATTERN INCLUDING A SEED LAYER AND A PLATING LAYER, AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A multilayer printed circuit board with a metal pattern which includes a seed layer and a plating layer and a manufacturing method thereof are provided to use an inkjet method, thereby reducing the use amount of metal. CONSTITUTION: A first adhesive layer(125) is equipped between a first substrate and a second substrate. At least one first metal pattern(140) is located on the upper surface of the first substrate. A third substrate(130) is faced with the lower surface of the first substrate. A second adhesive layer is equipped between the first substrate and the third substrate. At least one second metal pattern(150) is located on the lower surface of the first substrate. [Reference numerals] (AA) First direction