| 摘要 |
PURPOSE: A semiconductor package is provided to stably transfer an electric signal by using a clip as an electrical contact unit. CONSTITUTION: A substrate(110) includes an insulating substrate(111) and a conducting track(112). A semiconductor device(120) is mounted on the substrate. The semiconductor device includes a power device(121) or a control device(122). A housing(130) surrounds the semiconductor device and the substrate. Each lead frame(140) is separated from each other at regular intervals on the substrate. A clip(150) electrically connects the substrate to the lead frame. |
