| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a machining method using a fixed abrasive wire saw, configured to properly control wire tension at a cutting position in cutting a workpiece using the fixed abrasive wire saw, and to provide a wafer manufactured in the machining method. <P>SOLUTION: In the fixed abrasive wire saw 1, a wire row 20 formed by winding one fixed abrasive wire 10 on main rollers 18A, 18B multiple turns at a fixed pitch reciprocates in the longitudinal direction, and the workpiece 50 is pushed against the reciprocating wire row 20 so as to be cut at a plurality of positions simultaneously to form a plurality of wafers. The travelling direction is reversed when a travel distance of a wire portion located at a preset reference position on the wire pay-out side becomes equal to or larger than the length of the wire wound on the main rollers 18A, 18B. <P>COPYRIGHT: (C)2013,JPO&INPIT |
