MOLD PROCESSING FILM FOR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A mold processing film for a semiconductor package is provided to improve heat resistance and protest a lead and a terminal from a molding resin by closely masking the exposed part of a lead and terminal during a molding process. CONSTITUTION: A mold processing film comprises a base film(1) which has a one side where a corona processing is executed and an adhesive layer(2) which is spread to the corona processed surface of the base film. The adhesive layer is spread to composition including Acryl based polymer and UV curable Acrylate oligomer, photoinitiator, and hardener. The thickness of the adhesive layer is 2um~30um.