JOINT DEVICE, JOINT SYSTEM, JOINT METHOD, PROGRAM, AND COMPUTER STORAGE MEDIUM

摘要

PROBLEM TO BE SOLVED: To properly join a processed substrate to a support substrate.

SOLUTION: A joint part 113 of a joint device includes: a first holding part 200 holding a processed wafer W; a second holding part 201 which is disposed facing the first holding part 200 and holds a support wafer S; a pressurizing mechanism 270 which includes a pressure container 271 provided so as to cover the support wafer S held by the second holding part 201 and expanding and retracting in a vertical direction and causes a gas to flow into and out from the pressure container 271 thereby pressing the second holding part 201 to the first holding part 200 side; a processing container 290 which houses the first holding part 200, the second holding part 201, and the pressure container 271 and seals the interior; and a decompression mechanism 300 decompressing an atmosphere in the processing container 290.

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