POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM PREPARED BY USING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE PHOTOSENSITIVE RESIN FILM

摘要

PURPOSE: A positive type photo-sensitive resin composition, a photo-sensitive resin film manufactured using the same, and a semiconductor device including the photo-sensitive resin film are provided to improve sensitivity, resolution, pattern forming property, and residue removing property by including a dissolution adjusting agent containing a polybenzoxazole precursor with a specific functional group and a novolac resin with a specific structure. CONSTITUTION: A positive type photo-sensitive resin composition includes a repeating unit represented by chemical formula 1, a repeating unit represented by chemical formula 2, a polybenzoxazole precursor, a dissolution adjusting agent, a photo-sensitive diazoquinone compound, a silane compound, an acid generator, and a solvent. The polybenzoxazole precursor contains a first polybenzoxazole precursor with a thermopolymeric functional group on either of end parts. The novolac resin includes a repeating unit represented by chemical formula 4.