发明名称 THERMOSETTING COMPOSITION FOR FORMING MOISTURE CAPTURE BODY, MOISTURE CAPTURE BODY, AND ELECTRONIC DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a thermosetting composition for forming a moisture capture body, which can provide a moisture capture body only by curing through low-temperature heating without ultraviolet irradiation and generates no out gas during curing, a moisture capture body formed from the composition, and an electronic device provided with the moisture capture body. <P>SOLUTION: The thermosetting composition for forming a moisture capture body contains a compound (A) having a structural unit represented by general formula (1):-[Al(OR)-O]<SB POS="POST">n</SB>-; and a curable monomer (B). (In formula (1), R each represents substituted or unsubstituted alkyl, aryl or alkylcarbonyl, and n represents an integer of 2-6). <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013108057(A) 申请公布日期 2013.06.06
申请号 JP20120182969 申请日期 2012.08.22
申请人 JSR CORP 发明人 ARAI TAKAYUKI;TAKAHASHI MASAYUKI;KONNO KEIJI
分类号 C08F2/44;B01D53/28;B01J20/26;C08F20/00;H01L51/50;H05B33/04;H05B33/10 主分类号 C08F2/44
代理机构 代理人
主权项
地址