| 摘要 |
Provided is a primer composition that is capable of forming a primer layer, which has excellent adhesiveness and film-forming performance, on the surfaces of various materials that are able to be bonded with an epoxy adhesive. A primer composition which is composed of an epoxy resin, a curing agent, a curing catalyst and an inorganic oxide filler. The epoxy resin contains at least a bisphenol A epoxy resin and a phenolic novolac epoxy resin. The curing agent is dicyandiamide, and the curing catalyst is imidazole. The inorganic oxide filler contains 0.5-3 parts by weight of fumed silica, at least the surface of which is hydrophobic and which has primary particle diameters of 7-40 nm and specific surface areas of 50-380 m2/g, relative to 100 parts by weight of the total of the epoxy resin. The primer composition does not contain a solvent. |
