A low-power 4x4-pixel THz camera with responsiv ity greater than 2.5MV/W and sub- l OpW/vHz NEP at 0.25THz is integrated in 130nm silicon without using either high-resistivity substrates or silicon lenses. Imaging results with a fully integrated radiating CMOS power source demonstrate the first entirely silicon-based THz imager.
申请公布号
WO2013082622(A2)
申请公布日期
2013.06.06
申请号
WO2012US67649
申请日期
2012.12.03
申请人
CALIFORNIA INSTITUTE OF TECHNOLOGY;SENGUPTA, KAUSHIK;HAJIMIRI, SEYED, ALI