AGGLOMERATED BORON NITRIDE PARTICLES, COMPOSITION CONTAINING SAID PARTICLES, AND THREE-DIMENSIONAL INTEGRATED CIRCUIT HAVING LAYER COMPRISING SAID COMPOSITION

摘要

The purpose of the present invention is to provide a composition for a three-dimensional integrated circuit, which enables the formation of an interlayer filling layer having excellent heat conductivity in a thickness direction using aggregated boron nitride particles having excellent isotropism of heat conductivity, excellent fracture resistance and excellent kneadability with a resin. The composition for a three-dimensional integrated circuit according to the present invention comprises: spherical aggregated boron nitride particles each of which has a specific surface area of 10 m2/g or more and the surface of each of which is composed of boron nitride primary particles having an average particle diameter of 0.05 to 1 µm inclusive; and a resin which has a melt viscosity of 100 Pa·s or less at 120°C.