SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide means of reducing a size of a semiconductor device in a thickness direction.

SOLUTION: A semiconductor device 1 comprises: a first semiconductor chip 11; first conductors 13 formed on an electrode formation surface of the first semiconductor chip; a second semiconductor chip 21; second conductors 22 formed on an electrode formation surface of the second semiconductor chip; third conductors 23 formed on the electrode formation surface of the second semiconductor chip on parts where the second conductors are not formed; and external electrodes 15 connected to the third conductors. The first semiconductor chip is placed on the electrode formation surface of the second semiconductor chip such that the electrode formation surface of the first semiconductor chip faces the electrode formation surface of the second semiconductor chip, and the first conductors and the second conductors are connected.

COPYRIGHT: (C)2013,JPO&INPIT