| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide light-emitting device/assembly, system and method capable of enhancing radiation performance of heat from an LED. <P>SOLUTION: A light-emitting device/assembly (10, 50) comprises: a light-emitting diode chip (100, 500-1, 500-N); a substrate having two terminals; and one or more enclosure layer (108, 508). The first terminal (101, 501) has at least the same width as the LED chip, and has a part (103, 503) having the vertical cross-sectional area, the part being at least 30% that of the whole assembly thus enclosed. The one or more enclosure layer (108, 508) houses an adhesive (102, 502-1, 502-N) for connecting the LED chip to the first terminal. <P>COPYRIGHT: (C)2013,JPO&INPIT |
