| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical device layer transfer device and a laser processing machine which can surely remove an epitaxy substrate after breaking a buffer layer by emitting a laser beam from a rear side of the epitaxy substrate to the buffer layer. <P>SOLUTION: There is provided an optical device layer transfer device which joins an optical device layer of an optical device wafer in which the optical device layer is laminated on a surface of an epitaxy substrate through a buffer layer to a transfer substrate through a joint metal layer to form a composite substrate, and transfers the optical device layer to the transfer substrate by removing the epitaxy substrate after breaking the buffer layer by emitting a laser beam from a rear side of the epitaxy substrate to the buffer layer. The optical device layer transfer device includes: first holding means with a first holding face which holds a transfer substrate side of the composite substrate; second holding means with a second holding face which faces the first holding face and holds an epitaxy substrate side of the composite substrate; and separation means which moves the first holding means and the second holding means in a direction of relatively bringing them close to each other and separating them from each other. <P>COPYRIGHT: (C)2013,JPO&INPIT |
