发明名称 Capacitive Coupling of Bond Pads
摘要 In one embodiment, a system includes a touch sensor comprising a first set of electrodes and a first set of bond pads electrically coupled to the first set of electrodes. The system also includes a second set of bond pads capacitively coupled to the first set of bond pads. Each bond pad of the second set of bond pads is coincident with a bond pad of the first set of bond pads. The system also includes a circuit electrically coupled to the second set of bond pads such that signals may be communicated from the first set of bond pads to the circuit.
申请公布号 US2013141118(A1) 申请公布日期 2013.06.06
申请号 US201113309456 申请日期 2011.12.01
申请人 GUARD DAVID BRENT 发明人 GUARD DAVID BRENT
分类号 G01R27/26;B32B37/02 主分类号 G01R27/26
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