Reflow oven for soldering surface mount device (SMD) component on flexible printed circuit board, has tensioning unit that is provided for tensioning the flexible printed circuit board over solder pad

摘要

The reflow oven (11) has a near infrared (NIR) heater (12) that is provided for irradiating the lower-side of printed circuit board (L). The NIR diaphragm (17,18) is provided below the printed circuit board. A feed device is provided for feeding the printed circuit board in a transport direction (T) over the solder pad (F). A tensioning unit is provided for tensioning the flexible printed circuit board over the solder pad. An independent claim is included for method for soldering components on flexible printed circuit board.