发明名称 |
ANISOTROPIC CONDUCTIVE FILM WITH EASY PRE-BONDING PROCESS AND SEMICONDUCTOR DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an anisotropic conductive film in which a conductive adhesive layer and an insulation adhesive layer are laminated. <P>SOLUTION: There is provided an anisotropic conductive film in which a conductive adhesive layer and an insulation adhesive layer are laminated. A reactive monomer content of the conductive adhesive layer is set to be higher than that of the insulation adhesive layer to enhance an adhesive force of the conductive adhesive layer to glass, and thereby, a problem of failures at a pre-bonding process is improved. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013110110(A) |
申请公布日期 |
2013.06.06 |
申请号 |
JP20120250429 |
申请日期 |
2012.11.14 |
申请人 |
CHEIL INDUSTRIES INC |
发明人 |
KO YOUN JO;KIM JIN KYU;UH DONG-SEON;LEE KIL YONG;CHO JAUG HYUN |
分类号 |
H01R11/01;C09J4/02;C09J7/00;C09J9/02;C09J201/00;H01B1/22;H01B5/16;H05K3/32 |
主分类号 |
H01R11/01 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|