发明名称 ANISOTROPIC CONDUCTIVE FILM WITH EASY PRE-BONDING PROCESS AND SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide an anisotropic conductive film in which a conductive adhesive layer and an insulation adhesive layer are laminated. <P>SOLUTION: There is provided an anisotropic conductive film in which a conductive adhesive layer and an insulation adhesive layer are laminated. A reactive monomer content of the conductive adhesive layer is set to be higher than that of the insulation adhesive layer to enhance an adhesive force of the conductive adhesive layer to glass, and thereby, a problem of failures at a pre-bonding process is improved. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013110110(A) 申请公布日期 2013.06.06
申请号 JP20120250429 申请日期 2012.11.14
申请人 CHEIL INDUSTRIES INC 发明人 KO YOUN JO;KIM JIN KYU;UH DONG-SEON;LEE KIL YONG;CHO JAUG HYUN
分类号 H01R11/01;C09J4/02;C09J7/00;C09J9/02;C09J201/00;H01B1/22;H01B5/16;H05K3/32 主分类号 H01R11/01
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