| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent damage of a semiconductor card due to drop impact or the like by preventing the semiconductor card from being projected from the device body. <P>SOLUTION: This card slot device 20 is configured so as to be attached/detached to/from electronic equipment equipped with a pair of projecting parts 12a and 12b protruding near both side parts of one face of a casing and a convex section 13 formed between the pair of projecting parts 12a and 12b, and equipped with a slot 22 into/from which an SM card 30 can be inserted. The slot 22 is arranged at a position facing the recessed section 13 while the card slot device 20 is mounted on the electronic equipment 1 so that only a part of the SM card 30 can be stored. The slot 22 is arranged so that a part of the SM card 30 exposed from the slot 22 is fitted in the recessed section 13 when inserted into the slot 22. <P>COPYRIGHT: (C)2009,JPO&INPIT |
