发明名称 Method of repair of electronic device and repair system
摘要 A repair system which prevents heating of weakly heat resistant devices together and causing deterioration of the quality when preheating a first surface of the circuit board, wherein an electromagnetic induction material is buried in advance inside the circuit board near a specific electronic device envisioned as needed repair when becoming a defective electronic device in a production process and an electromagnetic coil emitting electromagnetic waves to an electromagnetic induction member in the vicinity of the repair device is provided and the heat generated by the electromagnetic induction member due to the electromagnetic waves enables the repair device to be heated and detached from the circuit board.
申请公布号 US8456854(B2) 申请公布日期 2013.06.04
申请号 US20080285632 申请日期 2008.10.09
申请人 IRIGUCHI SHIGEO;HATANAKA KIYOYUKI;WATANABE SATOSHI;TAKETOMI NOBUO;YAMAMOTO KEIICHI;SUGIE MASARU;FUJITSU LIMITED 发明人 IRIGUCHI SHIGEO;HATANAKA KIYOYUKI;WATANABE SATOSHI;TAKETOMI NOBUO;YAMAMOTO KEIICHI;SUGIE MASARU
分类号 H05K7/02;H05K7/06;H05K7/08;H05K7/10 主分类号 H05K7/02
代理机构 代理人
主权项
地址