发明名称 Method for producing sheet with IC tags, apparatus for producing sheet with IC tags, sheet with IC tags, method for fixing IC chips, apparatus for fixing IC chips, and IC tag
摘要 A method of producing a sheet 1 with IC tags comprises the steps of: preparing and feeding a sheet 21a with electrical conductors formed thereon; providing an adhesive 18 on the sheet 21a with electrical conductors; preparing multiple IC chips 20 and successively feeding the IC chips 20; successively arranging each IC chip 20 on the electrical conductors 22 of the sheet 21a; and fixing each IC chip 20 onto the electrical conductors 22 through the adhesive 18. The sheet 21a with electrical conductors formed thereon includes a non-conductive sheet 21 and a pair of electrical conductors 22. The pair of electrical conductors 22 of the sheet 21a with the electrical conductors are provided on the non-conductive sheet 21, extend in the feed direction, and are spaced apart from each other.
申请公布号 US8456307(B2) 申请公布日期 2013.06.04
申请号 US20070587240 申请日期 2007.05.04
申请人 SUGURO HIROSHI;SAKATA HIDETO;TSUCHIYA TERUNAO;SHIMOMURA TAKAICHI;DAI NIPPON PRINTING CO., LTD. 发明人 SUGURO HIROSHI;SAKATA HIDETO;TSUCHIYA TERUNAO;SHIMOMURA TAKAICHI
分类号 B42D15/10;G08B13/14;G06K19/00;G06K19/07;G06K19/077;H01L21/00;H01L21/60;H01L21/607;H01L23/498 主分类号 B42D15/10
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