Electronic device housing and manufacturing method thereof

摘要

An electronic device housing includes a bottom housing, a support frame, a display panel, and a side frame. The bottom housing includes a base plate and four sidewalls extending from a periphery of the base plate. The support frame is welded to the sidewalls of the bottom housing. The support frame is received in the bottom housing and made up of at least two support plates, two ends of each are welded to ends of the adjacent support plates. The support frame forms at least two welding lines at joints of the at least two support plates, and each welding line corresponds to a middle portion of one sidewall. The display panel is positioned on the support frame sandwiched between the support frame and the side frame. The side frame is connected to a top edge of the bottom housing.