SURFACE-MOUNTABLE OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING A SURFACE-MOUNTABLE OPTOELECTRONIC COMPONENT

摘要

A surface-mountable optoelectronic component has a radiation passage face, an optoelectronic semiconductor chip and a chip carrier. A cavity is formed in the chip carrier and the semiconductor chip is arranged in the cavity. A molding surrounds the chip carrier at least in places. The chip carrier extends completely through the molding in a vertical direction perpendicular to the radiation passage face.