| 摘要 |
PURPOSE: A light emitting device and a light emitting device package including the same are provided to minimize structural damage by naturally growing a second conductive semiconductor layer with an uneven surface along the surface of an undoped semiconductor layer. CONSTITUTION: An active layer(134) is formed on a first conductive semiconductor layer. An undoped semiconductor layer(150) with an uneven surface is formed on the active layer. A second conductive semiconductor layer(136) with an uneven surface is formed on the undoped semiconductor layer. The uneven surface of the second conductive semiconductor layer is lower than the uneven surface of the undoped semiconductor layer. The thickness of the undoped semiconductor layer is 2.5 to 5 nm.
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