| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem in which adjustment time before factory shipment takes long and there is a problem with respect to production efficiency and such because temperature increase of an imaging apparatus and accumulation time of a signal charge are required in order to more accurately detect a defect pixel. <P>SOLUTION: It is possible to shorten defective pixel detection time and enhance detection accuracy by changing a driving method of an image pickup device so that during defective pixel detection, a potential applied to a readout electrode existing at a readout gate part in an imaging apparatus is adjusted so that an interface of a semiconductor substrate at the readout gate part becomes in a deplete state, thus increasing a scratch occurrence frequency which is dependent on temperature and exposure time. <P>COPYRIGHT: (C)2013,JPO&INPIT |
