VOLUME CONTROL METHOD AND VOLUME CONTROL DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT, CONTROL PROGRAM, AND READABLE STORAGE MEDIUM

摘要

PROBLEM TO BE SOLVED: To stabilize a plating rate and a plated film thickness by suppressing changes in the concentration of a plating solution, due to water evaporation from the plating solution, and in the states of various components.

SOLUTION: A volume control device includes: an ultrasonic humidifier 9 as a vapor pressure control means for controlling the vapor pressure of a plating treatment liquid in a gas above the surface of the treatment liquid in a plating treatment tank 2; and an electrical equipment control unit 11 for adjusting the amount of the treatment liquid by controlling the ultrasonic humidifier 9 as the vapor pressure control means so that the surface position of the plating treatment liquid becomes a predetermined position.

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