| 发明名称 |
Bonding Material for Semiconductor Devices |
| 摘要 |
A semiconductor device is provided which has internal bonds which do not melt at the time of mounting on a substrate. A bonding material is used for internal bonding of the semiconductor device. The bonding material is obtained by filling the pores of a porous metal body having a mesh-like structure and covering the surface thereof with Sn or an Sn-based solder alloy. |
| 申请公布号 |
US2013134591(A1) |
申请公布日期 |
2013.05.30 |
| 申请号 |
US201113261584 |
申请日期 |
2011.08.03 |
| 申请人 |
SAKAMOTO YOSHITSUGU;YAMADA HIROYUKI;YAMANAKA YOSHIE;OHNISHI TSUKASA;YOSHIKAWA SHUNSAKU;TADOKORO KENZO |
发明人 |
SAKAMOTO YOSHITSUGU;YAMADA HIROYUKI;YAMANAKA YOSHIE;OHNISHI TSUKASA;YOSHIKAWA SHUNSAKU;TADOKORO KENZO |
| 分类号 |
B23K35/26;H01L23/00 |
主分类号 |
B23K35/26 |
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