发明名称 SLURRY, POLISHING LIQUID SET, POLISHING LIQUID, METHOD FOR POLISHING SUBSTRATE, AND SUBSTRATE
摘要 The polishing liquid according to the embodiment comprises abrasive grains, an additive and water, wherein the abrasive grains include a tetravalent metal element hydroxide, and produce a liquid phase with a nonvolatile content of 500 ppm or greater when an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass % has been centrifuged for 50 minutes at a centrifugal acceleration of 1.59×105 G.
申请公布号 US2013137265(A1) 申请公布日期 2013.05.30
申请号 US201313755024 申请日期 2013.01.31
申请人 IWANO TOMOHIRO 发明人 IWANO TOMOHIRO
分类号 H01L21/306;C09K13/12 主分类号 H01L21/306
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