| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing device capable of preventing excessive polishing. <P>SOLUTION: The polishing device (100) in an embodiment includes a stage (101), polishing parts (102, 104), a detection unit (110), and a lock mechanism (120). The stage (101) has a semiconductor substrate mounted thereon. The polishing parts (102, 104) grind a peripheral edge part of the semiconductor substrate from an upper side of the semiconductor substrate. The detection unit (110) detects a reference height position of the semiconductor substrate. The lock mechanism (120) restrains the movement of the polishing parts (102, 104) so that the further movement of the polishing parts (102, 104) to a semiconductor substrate face side is stopped, when polishing parts (102, 104) move by only a prescribed distance from the reference height position to the semiconductor substrate face side. <P>COPYRIGHT: (C)2013,JPO&INPIT |
