| 摘要 |
The invention relates to a device for vacuum coating substrates in a vacuum chamber, comprising an elongated evaporator array having a plurality of evaporator elements arranged along a longitudinal axis and a first substrate carrier unit which is associated with the evaporator array and has a first pylon that can be rotated about a first axis and contains retaining means for substrates, wherein an angular offset of less than 10° is present between the longitudinal axis and the first rotational axis. The device is characterised in that at least one second substrate carrier unit is provided, which is associated with the evaporator array and has a second pylon that can be rotated about a second axis and contains retaining means for substrates, wherein an angular offset of less than 10° is present between the longitudinal axis and the second rotational axis. At least one second substrate carrier unit (22, 122, 222) which is associated with the evaporator array (10, 110, 110a) and has a second pylon that can be rotated about a second rotational axis (42, 242) and contains retaining means for substrates is provided, wherein the axes of the pylons are designed to be fixed relative to the longitudinal axis (40) of the evaporator array, an angular offset of less than 10° is present between the longitudinal axis (40) and second rotational axis (42, 242), and a geometric configuration of the evaporator array (10, 110, 110a) and of the first (21, 121, 221) and the at least second substrate carrier units (22, 122, 222) is provided such that substrates of the first (21, 121, 221) and the at least second substrate carrier units (22, 122, 222) can be coated with the same quality by means of the evaporator array (10). The invention further relates to a method for vacuum coating by means of the device. |
