SEMICONDUCTOR SUBSTRATE AND METHOD OF FORMING SOLDER BALL BUMP FOR THE SEMICONDUCTOR SUBSTRATE

摘要

PURPOSE: A semiconductor device and a method for forming a solder ball bump for a semiconductor substrate are provided to stably mount a semiconductor chip with high performance on a substrate by accurately forming a solder bump in a fine pitch below 150 um. CONSTITUTION: Magnetic materials with first magnetism are coated on the surface of a solder ball(S310). Magnetic materials with second magnetism are coated on a conductive pad formed on the semiconductor substrate(S320). The first magnetism is opposite to the second magnetism. The solder ball coated with the magnetic materials with the first magnetism is transferred on the conductive pad coated with the magnetic materials with the second magnetism(S330). A solder bump is formed by heating the semiconductor substrate with the transferred solder ball over a solder ball melting point(S340). [Reference numerals] (AA) Start; (BB) End; (S310) Coat magnetic materials with first magnetism on the surface of a solder ball; (S320) Coat magnetic materials with second magnetism opposite magnetism of the first magnetism on a conductive pad formed on a semiconductor substrate; (S330) Transfer the solder ball coated with the magnetic materials with the first magnetism on the conductive pad coated with the magnetic materials with the second magnetism; (S340) Form a solder bump by heating the semiconductor substrate with the transferred solder ball over a solder ball melting point