发明名称 Microstructure Device with an Improved Anchor
摘要 A microelectromechanical system (MEMS) device includes a substrate and an oxide layer formed on the substrate. A cavity is etched in the oxide layer. A microstructure device layer is bonded to the oxide layer, over the cavity. The microstructure device layer includes a substantially solid microstructure MEMS device formed in the microstructure device layer and suspended over a portion of the cavity. An anchor is formed in the device layer and configured to support the microstructure device, the anchor having an undercut in the oxide layer. The undercut has a length along the anchor that is less than one-half a length of an outer boundary dimension of the microstructure MEMS device.
申请公布号 US2013126989(A1) 申请公布日期 2013.05.23
申请号 US201213721734 申请日期 2012.12.20
申请人 COMPANY, LTD. TAIWAN SEMICONDUCTOR MANUFACTURING;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 LIN CHUNG-HSIEN;CHENG CHUN-WEN;CHU CHIA-HUA;TSAI YI HENG
分类号 H01L29/84 主分类号 H01L29/84
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