| 摘要 |
PURPOSE: A method for manufacturing a chip is provided to efficiently manufacture the chip with a cover by removing laminates from a division reserved line of a device wafer after a bonded wafer is formed. CONSTITUTION: A device wafer(11) with each device in each region divided by a plurality of division reserved lines is prepared. Laminates are removed from the division reserved line by irradiating laser beams along the division reserved line of the device wafer. A bonded wafer is formed by forming an adhesive member in a region to surround each device and attaching a cover wafer to the surface of the device wafer. A chip with a cover plate is formed by dividing the bonded wafer along the division reserved line.
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