发明名称 |
Method of fabricating an integrated circuit package |
摘要 |
A method of forming a semiconductor package is provided. The method includes forming a leadframe wherein the conductors or leads of the leadframe extend from a first end to a second end such that a portion of each lead exhibits a generally arcuate shape. The first end may be coupled with a printed circuit board and the second end may be coupled with a semiconductor die. The generally arcuately shaped portion of the leads may include a portion which exhibits a constant radius. The generally arcuately shaped portion may also be formed from a plurality of conductor segments including, for example, at least one generally arcuately shaped segment. The semiconductor die and at least a portion of the leads may be encapsulated with an insulating material. |
申请公布号 |
US2004255454(A1) |
申请公布日期 |
2004.12.23 |
申请号 |
US20040895530 |
申请日期 |
2004.07.21 |
申请人 |
HARRISON RONNIE M.;CORISIS DAVID J. |
发明人 |
HARRISON RONNIE M.;CORISIS DAVID J. |
分类号 |
H01L23/495;(IPC1-7):H05K3/20 |
主分类号 |
H01L23/495 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|