| 摘要 |
<p>A wire inspection method for determining whether or not a wire formed on a substrate has a short-circuit defect part (20), the method involving a heating step (S3 to S6) for heating the short-circuit defect part (20) by applying a voltage to the wire, an image acquisition step (S2 to S5) for acquiring an infrared image at multiple times by imaging the substrate, a heating region recognition step (S8) for recognizing a heating region (21) by using the infrared image at a predetermined time, a heating region determination step (S9) for determining whether it is possible to identify the position of the short-circuit defect part (20) in the heating region (21), and a defect position identification step (S10) for identifying the position of the short-circuit defect part (20) in the heating region (21), wherein the heating region recognition step is characterized by recognizing the heating region (21) by using the infrared image at a time that is different from the predetermined time when it is determined that it is not possible to identify the position of the short-circuit defect part (20) in the heating region recognition step.</p> |
