METHOD OF FABRICATING AND TRANSFERRING A MICRO DEVICE AND AN ARRAY OF MICRO DEVICES UTILIZING AN INTERMEDIATE ELECTRICALLY CONDUCTIVE BONDING LAYER

摘要

A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.