发明名称 NOVEL INSULATING FILM AND PRINTED WIRING BOARD WITH INSULATING FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide an insulating film having excellent tack-free properties, excellent flexibility durable against repeated folding, fire retardancy, electric insulation reliability, and deformation of which is small during hot press, and warpage is also small, and to provide a printed wiring board with an insulating film. <P>SOLUTION: The insulating film contains at least (A) a binder polymer and (B) organic-inorganic composite particles. The (B) organic-inorganic composite particles are dispersed into the insulating film, and within an arbitrary range of 125 &mu;m&times;15 &mu;m in the cross section of the insulating film in the thickness direction, the (B) organic-inorganic composite particles occupy the area of 10-60%. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013101999(A) 申请公布日期 2013.05.23
申请号 JP20110243778 申请日期 2011.11.07
申请人 KANEKA CORP 发明人 OGISO TETSUYA;SEKITO YOSHIHIDE
分类号 H05K1/03;C08K9/00;C08L101/00;G03F7/004;H01B3/00;H01B3/30;H05K3/28 主分类号 H05K1/03
代理机构 代理人
主权项
地址