| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a copper alloy for electronic devices that has a low Young's modulus, high proof strength, high conductivity, and high bending workability and is suitable for components for electronic devices such as terminals, connectors, relays, lead frames, etc. and to provide a method of manufacturing the same, copper alloy plastic working material for electronic devices and components for electronic devices. <P>SOLUTION: The copper alloy includes ≥3.3 atom% and ≤6.9 atom% of Mg, and the balance substantially comprising of Cu and inevitable impurities, wherein the electric conductivity σ (%IACS) is within a range of σ≤1.7241/(-0.0347×X<SP POS="POST">2</SP>+0.6569×X+1.7)×100, where the density of Mg is X atom%, and the average crystalline particle diameter is within a range of ≥1 μm and ≤100 μm. In addition, the average crystalline particle diameter of copper material after intermediate heat treatment and before finishing process is within a range of ≥1 μm and ≤100 μm. <P>COPYRIGHT: (C)2013,JPO&INPIT |
