| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cleaning method capable of reducing deposits in a plasma processing device. <P>SOLUTION: In a plasma processing device, slots arranged in a circumferential direction with respect to an axis line are formed in a slot plate of an antenna. A microwave is introduced from the antenna into a processing space via a dielectric window. A through hole is formed in the dielectric window along the axis line. A plasma processing method in this plasma processing device includes the steps of: emitting a microwave from the antenna, supplying a cleaning gas from a cleaning gas supply system, and performing a first cleaning; and (b) emitting a microwave from the antenna, supplying a cleaning gas from the cleaning gas supply system, and performing a second cleaning. A first pressure in the processing space in the first cleaning step is lower than a second pressure in the processing space in the second cleaning step. <P>COPYRIGHT: (C)2013,JPO&INPIT |
