| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can reliably interrupt current when an excess current flows. <P>SOLUTION: A semiconductor device 100 comprises a first semiconductor member 10, a second semiconductor member 20, and a mold resin 40 integrally molding the first semiconductor member 10 and the second semiconductor member 20. A first connection part 12a of the first semiconductor member 10 and a second connection part 21a of the second semiconductor member 20 have facing parts, respectively, arranged to face each other at positions exposed from the mold resin 40. The facing parts of the first connection part 12a and the second connection part 21a respectively include contact parts 12a1, 21a1 electrically and mechanically connected with each other, and non-contact parts 12a2, 21a2 which do not contact each other and have current flowing directions inverse to each other to apply a repulsive force to each other. <P>COPYRIGHT: (C)2013,JPO&INPIT |
