| 摘要 |
Disclosed is a curable resin composition which includes a ladder-type silsesquioxane (A) having an aliphatic carbon-carbon double bond in the molecule; a ladder-type silsesquioxane (B) having a Si-H bond in the molecule; and a hydrosilylation catalyst. The curable resin composition is useful as sealants typically for optical semiconductor elements. Also disclosed is a cured article which is obtained by curing the curable resin composition. The curable resin composition can give such a cured article having properties including resistance to elevated temperatures, flexibility, transparency, resistance to thermal yellowing, and resistance to photoyellowing. |
