| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition in which a cured product excellent in dimensional stability is obtained, an insulating layer excellent in low temperature meltability is obtained, and that is also excellent in dissolution stability to a solvent, and to provide an interlayer adhesion film to obtain the insulating layer. <P>SOLUTION: The thermosetting resin composition includes: a polyimide resin (A) that has a structure shown by general formula (1), and a dimethylbiphenyl backbone connected directly with a five-membered ring imide skeleton, and in which the content of the dimethylbiphenyl backbone is 20-40 mass%; and an epoxy resin (B). In the formula, X has at least two phenolic hydroxyl groups in one molecule, and denotes a residue that excludes two phenolic hydroxyl groups from a resin the weight average molecular weight of which is 500-10,000. <P>COPYRIGHT: (C)2013,JPO&INPIT |
