| 摘要 |
<P>PROBLEM TO BE SOLVED: To maintain the adhesion of a wiring pattern to a translucent alumina substrate after applying a heat cycle, in a translucent wiring board, and to ensure translucency of the wiring board. <P>SOLUTION: A translucent wiring board 8 comprises a translucent alumina substrate 1 and a wiring pattern 2 formed on the translucent alumina substrate 1. Translucent alumina constituting the translucent alumina substrate 1 has an SiO<SB POS="POST">2</SB>content of 150-300 mass ppm and an MgO content of 100-250 mass ppm, the SiO<SB POS="POST">2</SB>content is larger than the MgO content, the purity of alumina excluding SiO<SB POS="POST">2</SB>and MgO is ≥99.9 mass%, and a crystal grain diameter is ≥20 μm. The total forward transmittance of the translucent alumina substrate 1 in a part other than the wiring pattern 2 is ≥50%. <P>COPYRIGHT: (C)2013,JPO&INPIT |
