发明名称 POLYAMIDE RESIN COMPOSITION AND MOLDING
摘要 <P>PROBLEM TO BE SOLVED: To provide a polyamide resin composition excellent in mechanical strength, rigidity, and weather resistance. <P>SOLUTION: The polyamide resin composition includes, based on 100 pts.wt. of a mixture polyamide resin (A) that at least contains 50-75 wt.% of a polymetaxylylene adipamide resin, and 25-50 wt.% of a polyamide 6 resin, and in which the blending amount of other polyamide resins is at most 6 wt.%: 100-160 pts.wt. of an inorganic filler (B); and 4-20 pts.wt. of carbon black (C), wherein at least one kind of the inorganic filler (B) is a glass fiber in which the average fiber diameter is over 10 &mu;m and at most 20 &mu;m. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013100412(A) 申请公布日期 2013.05.23
申请号 JP20110245129 申请日期 2011.11.09
申请人 MITSUBISHI ENGINEERING PLASTICS CORP 发明人 OGAWA TAKASHI
分类号 C08L77/06;C08K3/00;C08K3/04;C08K3/34;C08K7/14;C08L77/02 主分类号 C08L77/06
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