A FLEXIBLE ELECTRONIC DEVICE, METHOD FOR MANUFACTURING SAME, AND A FLEXIBLE SUBSTRATE

摘要

The present invention relates to resolving issues concerning deterioration in the performance and yield of a flexible electronic device, caused by low manufacturing temperatures, high degrees of surface roughness, a high thermal expansion coefficients, and bad handling characteristics of typical flexible substrates. The method for manufacturing a flexible electronic device according to the present invention includes: forming a flexible substrate on a motherboard while physically separating the interface therebetween so that the interfacial bonding therebetween has a yield strength less than that of the flexible substrate; and forming an electronic device on the separated surface of the flexible substrate which had previously been in contact with the motherboard.