OPTICAL INTERCONNECTION MODULE

摘要

PURPOSE: An optoelectronic wiring module is provided to increase a manufacturing speed by facilitating a mounting process which devices and parts are being mounted on a substrate and to facilitate mass production with low lost and high reliability without a separate process of devices and parts of an optoelectronic wiring module. CONSTITUTION: An optoelectronic wiring module includes a frame(42), a substrate(41), an optical device package(45), an optical control device(44) and an optical waveguide(46). A groove is formed on the bottom of the frame and the optical control device is mounted on an electrode pad of the substrate through the groove. The optical device package performs optoelectronic conversion or electro-optic conversion of a signal. The optical control device controls operation of the optical device package. The optical waveguide is installed in the optical device package and transmits an optical signal emitted from the optical device package or incident into the optical device package. [Reference numerals] (41) Substrate; (42) Frame; (43) Electric terminal; (43a) Electric lead; (44) Optical control device; (45) Optical device package; (46) Optical waveguide