| 发明名称 |
Aqueous composition for etching of copper and copper alloys |
| 摘要 |
The present invention relates to an aqueous composition and a process for etching of copper and copper alloys. The aqueous composition comprises Fe 3+ ions, an acid and a N-alkoxylated polyamide. The aqueous composition is particularly useful for making of fine structures in the manufacture of printed circuit boards, IC substrates and the like. |
| 申请公布号 |
EP2594662(A1) |
申请公布日期 |
2013.05.22 |
| 申请号 |
EP20110189954 |
申请日期 |
2011.11.21 |
| 申请人 |
ATOTECH DEUTSCHLAND GMBH |
发明人 |
LUETZOW, DR. NORBERT;THOMS, MARTIN;EXNER, ANIKA;KLOPPISCH, MIRKO |
| 分类号 |
C23F1/18;C23F1/44;C23F1/46;H01L21/3213;H05K3/06;H05K3/10 |
主分类号 |
C23F1/18 |
| 代理机构 |
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