SUBSTRATE AND ELECTRONIC DEVICE COMPRISING THE SAME

摘要

PURPOSE: A substrate and an electronic device including thereof are provided to remove or relieve the whole deformation when the semiconductor is mounted. CONSTITUTION: A substrate comprises a first surface(105a) and a second surface(105b) which faces to the first surface. In the first surface of the substrate, a semiconductor package or a semiconductor die(101) is mounted. The substrate is divided into a first part(110a) which close to the first surface and a second part(110b) which is close to the second surface based on a central plane(115). A coefficient of thermal expansion the first part is greater than a coefficient of thermal expansion in the second part. The first part and the second part comprise more than one of a prepreg layer, respectively.